ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,409,645, issued on Sept. 9, was assigned to AUO Corp. (Hsinchu, Taiwan).
"Lamination apparatus and lamination method" was invented by Yu-Lun Chang (Hsinchu, Taiwan) and Kuan-Hsun Chen (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A lamination apparatus is adapted to laminate an encapsulation glue and a panel. The lamination apparatus includes a lower mold, an upper mold, and a cutting knife. The lower mold has a lamination area and a peripheral area adjacent to the lamination area. The panel is adapted to be retained in the lamination area. The upper mold is movable close to or away from the lower mold, and includes an encapsulation g...