ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,422,129, issued on Sept. 23, was assigned to AUO Corp. (Hsinchu, Taiwan).
"Backlight module and assembly method thereof" was invented by Yin-Ting Lee (Hsinchu, Taiwan), Hui-Chuan Chen (Hsinchu, Taiwan), Bo-Yuan Su (Hsinchu, Taiwan) and Pei-Chia Wu (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A backlight module includes a back plate, a conductive colloid disposed on a surface of the back plate, and a lighting board. The back plate includes a positioning portion. The lighting board includes a substrate and a plurality of light-emitting components. A first surface of the substrate is divided into a light-emitting region adjacent to a fi...