ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,693, issued on Nov. 25, was assigned to AUO Corp. (Hsinchu, Taiwan).
"Light-emitting device array substrate and method for fabricating the same" was invented by Shih-Lun Lai (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A light-emitting device array substrate includes a carrier, a plurality of adhesive patterns, and a plurality of light-emitting devices. The adhesive patterns are arranged in an array on the carrier. Each of the light-emitting devices is disposed on a first adhesive pattern among the adhesive patterns. An area of a first surface of each of the first adhesive patterns adjacent to the light-emitting device is less tha...