US Patent Issued to AUO on May 27 for "Method of manufacturing a device substrate" (Taiwanese Inventors)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,317,423, issued on May 27, was assigned to AUO Corp. (Hsinchu, Taiwan).

"Method of manufacturing a device substrate" was invented by Chun-Yueh Hou (Hsinchu, Taiwan) and Hao-An Chuang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A device substrate includes a circuit substrate and a side wiring structure. The circuit substrate includes a substrate and a front circuit structure on a front side of the substrate. The side wiring structure is electrically connected to the front circuit structure and extends from the front circuit structure to a back side of the circuit substrate. A cross-sectional structure of the side wiring structure incl...