US Patent Issued to AUO on June 24 for "Device substrate and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., June 25 -- United States Patent no. 12,341,143, issued on June 24, was assigned to AUO Corp. (Hsinchu, Taiwan).

"Device substrate and manufacturing method thereof" was invented by Yun Cheng (Hsinchu, Taiwan), Hsi-Hung Chen (Hsinchu, Taiwan) and Hao-An Chuang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A device substrate, including a circuit substrate, a first side wiring, a sealant structure, and a second side wiring, is provided. The first side wiring extends from a first surface of the circuit substrate to a second surface of the circuit substrate along a side surface of the circuit substrate. The sealant structure is located above the first surface and covers the first...