US Patent Issued to AUO on July 22 for "Side wiring structure and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., July 23 -- United States Patent no. 12,369,246, issued on July 22, was assigned to AUO Corp. (Hsinchu, Taiwan).

"Side wiring structure and manufacturing method thereof" was invented by Hsi-Hung Chen (Hsinchu, Taiwan) and Hao-An Chuang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A side wiring structure includes a first substrate, a first wiring structure, a first side wire, a first insulating adhesive structure, a second side wire, a first flexible circuit board, and a second flexible circuit board. The first wiring structure is located on a first surface of the first substrate. The first side wire extends from the first wiring structure on the first surface to the second ...