US Patent Issued to AUO on Dec. 9 for "Light emitting device having a encapsulation layer covering a circuit structure and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,494,459, issued on Dec. 9, was assigned to AUO Corp. (Hsinchu, Taiwan).

"Light emitting device having a encapsulation layer covering a circuit structure and manufacturing method thereof" was invented by Hao-Lun Hsieh (Hsinchu, Taiwan), Shuo-Yang Sun (Hsinchu, Taiwan), Fu-Yang Chen (Hsinchu, Taiwan), Xiao-Yun Li (Hsinchu, Taiwan), Yu-Hao Chang (Hsinchu, Taiwan) and Jhih-Jhu Jhan (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A light emitting device includes a light emitting diode package structure. The light emitting diode package structure includes a circuit structure, a plurality of light emitting diodes, and an encapsulation layer. The...