ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,389,727, issued on Aug. 12, was assigned to AUO Corp. (Hsin-Chu, Taiwan).
"Package structure and manufacturing method thereof" was invented by Fu-Wei Chan (Hsin-Chu, Taiwan), Kuan-Hsun Chen (Hsin-Chu, Taiwan) and Yi-Hsin Lin (Hsin-Chu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure includes a circuit substrate, a light emitting diode array, a first encapsulant, and a sealant. The circuit substrate includes a top surface and a side surface of the circuit substrate. The light emitting diode array is disposed on the top surface of the circuit substrate. The first encapsulant is disposed above the circuit substrate. The first enca...