US Patent Issued to Atotech Deutschland on Oct. 7 for "Method of preparing a high density interconnect printed circuit board including microvias filled with copper" (German Inventors)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,439,528, issued on Oct. 7, was assigned to Atotech Deutschland Gmbh & Co. KG (Berlin).

"Method of preparing a high density interconnect printed circuit board including microvias filled with copper" was invented by Bert Reents (Berlin), Akif Ozkok (Berlin), Soungsoo Kim (Berlin), Horst Bruggmann (Berlin), Herwig Josef Berthold (Berlin), Marcin Klobus (Berlin), Thomas Schiwon (Berlin) and Marko Mirkovic (Berlin).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention refers to a method of preparing a high density interconnect printed circuit board (HDI PCB) or IC substrates including through-holes and/or grate structures filled with copper, whi...