ALEXANDRIA, Va., July 16 -- United States Patent no. 12,359,332, issued on July 15, was assigned to Atotech Deutschland GmbH & Co. KG (Berlin).
"Copper electroplating bath" was invented by Heiko Brunner (Berlin), Sandra Heyde (Berlin), Peter Haack (Berlin) and Angela Llavona-Serrano (Berlin).
According to the abstract* released by the U.S. Patent & Trademark Office: "The invention relates to aqueous acidic plating baths for electrodeposition of copper and copper alloys in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to the present invention comprises copper ions, at least one acid and an ureylene polymer. The plating bath is particularly ...