ALEXANDRIA, Va., June 17 -- United States Patent no. 12,315,957, issued on May 27, was assigned to Atieva Inc. (Newark, Calif.).
"Multi-axis ultrasonic wedge wire bonding" was invented by Dodgiereigh M. Calpito (Fairfield, Calif.), Brandon Weber (Maricopa, Ariz.), Jean-Philippe Gauthier (San Francisco) and James Hawkins (Fremont, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "In a general aspect, an electrical device assembly (e.g., a battery module) can include a first electrical contact surface, a second electrical contact surface, and a ribbon wire extending along a longitudinal axis. The ribbon wire can include a first portion, a second portion and a third portion. The first portion of the ribbon ...