US Patent Issued to Atieva on Jan. 28 for "Multiple-direction wedge wire bonding" (California Inventor)

ALEXANDRIA, Va., Jan. 29 -- United States Patent no. 12,212,019, issued on Jan. 28, was assigned to Atieva Inc (Newark, Calif.).

"Multiple-direction wedge wire bonding" was invented by DodgieReigh M. Calpito (Fairfield, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "In a general aspect, an electrical device assembly (e.g., a battery module) can include first, second and third electrical contact surface. The first and second electrical contact surfaces can be spaced from the third electrical contact surface in a common direction. The assembly can include a ribbon wire electrically coupling the first electrical contact surface with each of the second electrical contact surface and the third electrical c...