US Patent Issued to AT&SAustria Technologie & Systemtechnik on May 6 for "Component carrier with partially metallized hole using anti-plating dielectric structure and electroless plateable separation barriers" (Chinese Inventor)

ALEXANDRIA, Va., June 10 -- United States Patent no. 12,295,108, issued on May 6, was assigned to AT&SAustria Technologie & Systemtechnik AG (Leoben, Austria).

"Component carrier with partially metallized hole using anti-plating dielectric structure and electroless plateable separation barriers" was invented by Jiangfeng Zhou (Wuxi, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A component carrier includes a stack with at least one electrically conductive layer structure, at least one electrically insulating layer structure, and a hole in the stack having a first hole portion covered with metal and having a second hole portion not covered with metal, wherein the second hole portion is defined by an an...