US Patent Issued to AT&SAustria Technologie & Systemtechnik on Aug. 19 for "Component carrier with a via containing a hardened filling material" (Austrian, Spanish Inventors)

ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,396,091, issued on Aug. 19, was assigned to AT&SAustria Technologie & Systemtechnik AG (Leoben, Austria).

"Component carrier with a via containing a hardened filling material" was invented by Shuying Yao (Leoben, Austria), Abderrazzaq Ifis (Leoben, Austria), Jens Riedler (Trofaiach, Austria) and Vanesa Lopez Blanco (Vimianzo, Spain).

According to the abstract* released by the U.S. Patent & Trademark Office: "A component carrier having a stack with at least one electrically conductive layer structure and at least one electrically insulating layer structure; an opening located at least partially in the stack; and a fill material which is located within the opening. The fill material is...