US Patent Issued to AT & S Austria Technologie & Systemtechnik on Nov. 11 for "Interconnection of printed circuit boards with nanowires" (Austrian Inventors)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,471,203, issued on Nov. 11, was assigned to AT & S Austria Technologie & Systemtechnik AG (Leoben, Austria).

"Interconnection of printed circuit boards with nanowires" was invented by Klaus Haimlinger (Kobenz, Austria), Christian Hoelzl (St. Marein-Feistritz, Austria) and Marco Gavagnin (Leoben, Austria).

According to the abstract* released by the U.S. Patent & Trademark Office: "A carrier assembly may include a first carrier sub-assembly, said first carrier sub-assembly having an elongated shape and comprising at least one electrically conductive layer structure and at least one electrically insulating layer structure, said at least one electrically conductive layer structure extend...