US Patent Issued to ASUSTEK COMPUTER on Oct. 7 for "Heat insulation pad and electronic device with heat insulation pad" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,439,533, issued on Oct. 7, was assigned to ASUSTEK COMPUTER INC. (Taipei, Taiwan).

"Heat insulation pad and electronic device with heat insulation pad" was invented by Yu-Jung Lin (Taipei, Taiwan), Ing-Jer Chiou (Taipei, Taiwan) and Cheng-Yu Wang (Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A heat insulation pad applied to an electronic device is provided. The electronic device includes a housing and a heat source. The housing includes an inner side surface. The heat insulation pad includes a first contact layer, a second contact layer, and a hole layer stack structure. The first contact layer is adapted to attach to the inner side surf...