ALEXANDRIA, Va., June 9 -- United States Patent no. 12,288,711, issued on April 29, was assigned to Assembleon B.V. (Eindhoven, Netherlands).
"Methods of operating die attach systems" was invented by Alain De Bock (Neerpelt, Belgium) and Rene Bouman (Vught, Netherlands).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method of operating a die attach system is provided. The method includes the step of providing a verification substrate configured to receive a plurality of die, the verification substrate including a plurality of substrate reference markers. The method also includes the step of imaging each of the plurality of die with respective ones of the plurality of substrate reference markers using an ima...