ALEXANDRIA, Va., June 16 -- United States Patent no. 12,304,001, issued on May 20, was assigned to ASMPT SINGAPORE PTE. LTD. (Singapore).
"Optimised laser cutting" was invented by Paul Verburg (Nijmegen, Netherlands).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method of cutting a wafer by irradiating the wafer with laser energy, comprises emitting a sequence of successive laser beam pulses having a first set of laser beam pulses and a second set of laser beam pulses, the first set of laser beam pulses comprising: laser beam pulses having respective pulse widths in the range from 0.1 to 300 nanoseconds, or a plurality of bursts of laser beam pulses having an inter-burst spacing in the range from 0.1 to 10...