US Patent Issued to ASMPT SINGAPORE on Jan. 13 for "Compliant locating structure for a bond head assembly" (Chinese, Singaporean Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,571, issued on Jan. 13, was assigned to ASMPT SINGAPORE PTE. LTD. (Singapore).

"Compliant locating structure for a bond head assembly" was invented by Ajit Shriman Gaunekar (Singapore), Mantian Ye (Hong Kong), Ho Chong Wong (Hong Kong), Gary Peter Widdowson (Hong Kong) and Chi Ming Chong (Hong Kong).

According to the abstract* released by the U.S. Patent & Trademark Office: "A bond head assembly includes a collet and a planar compliant locating structure having a plane. The collet is operative to hold a die during a bonding process. The planar compliant locating structure includes a first flexural element that is positioned to contact a first side surface of the collet and a seco...