US Patent Issued to ASMPT Singapore on Dec. 30 for "Method and apparatus for conducting shear tests on interconnect bonds" (Singaporean, Chinese Inventors)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,510,451, issued on Dec. 30, was assigned to ASMPT Singapore Pte. Ltd. (Singapore).

"Method and apparatus for conducting shear tests on interconnect bonds" was invented by Keng Yew Song (Singapore), Zui Hong Lee (Singapore), Jian Min Chen (Chengdu, China), Mow Huat Goh (Singapore) and Kien Kia Tan (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "A shear test is conducted on an interconnect bond formed on a surface of an electronic device by first determining a profile of the surface, and based on the determined profile, determining a shearing path which is at a substantially constant distance from the profile of the surface for a shear test tool...