US Patent Issued to ASML NETHERLANDS on June 3 for "Method for applying a deposition model in a semiconductor manufacturing process" (Dutch Inventors)

ALEXANDRIA, Va., June 4 -- United States Patent no. 12,321,101, issued on June 3, was assigned to ASML NETHERLANDS B.V. (Veldhoven, Netherlands).

"Method for applying a deposition model in a semiconductor manufacturing process" was invented by Maxim Pisarenco (Son en Breugel, Netherlands), Maurits Van Der Schaar (Eindhoven, Netherlands), Huaichen Zhang (Eindhoven, Netherlands) and Marie-Claire Van Lare (Utrecht, Netherlands).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for applying a deposition model in a semiconductor manufacturing process. The method includes predicting a deposition profile of a substrate using the deposition model; and using the predicted deposition profile to enhance a metrolog...