US Patent Issued to ASML Netherlands on July 22 for "Method, apparatus, and system for dynamically controlling an electrostatic chuck during an inspection of wafer" (California Inventors)

ALEXANDRIA, Va., July 23 -- United States Patent no. 12,368,067, issued on July 22, was assigned to ASML Netherlands B.V. (Veldhoven, Netherlands).

"Method, apparatus, and system for dynamically controlling an electrostatic chuck during an inspection of wafer" was invented by Yixiang Wang (Fremont, Calif.), Shibing Liu (San Jose, Calif.) and Ying Luo (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electrostatic chuck control system configured to be utilized during an inspection process of a wafer, the electrostatic chuck control system comprising an electrostatic chuck of a stage configured to be undocked during the inspection process, wherein the electrostatic chuck comprises a plurality...