ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,394,674, issued on Aug. 19, was assigned to ASML Netherlands B.V. (Veldhoven, Netherlands).
"Method and machine for examining wafers" was invented by Chien-Hung Chou (San Jose, Calif.) and Wen-Tin Tai (Fremont, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Method and machine utilizes the real-time recipe to perform weak point inspection on a series of wafers during the fabrication of integrated circuits. Each real-time recipe essentially corresponds to a practical fabrication history of a wafer to be examined and/or the examination results of at least one examined wafer of same "lot". Therefore, different wafers can be examined by using differen...