ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,424,435, issued on Sept. 23, was assigned to ASM IP Holding B.V. (Almere, Netherlands).
"Substrate processing method" was invented by TaeHee Yoo (Bucheon-si, South Korea), SeWoong Jung (Hwaseong-si, South Korea) and JuHyuk Park (Hwaseong-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing method of filling a recess without voids or seams includes least partially filling a trench with a first material on a substrate including the trench; and supplying at least one constituent element included in the first material and applying plasma to induce fluidization of the first material."
The patent was filed on July 18, 2022, ...