ALEXANDRIA, Va., March 19 -- United States Patent no. 12,252,790, issued on March 18, was assigned to ASM IP Holding B.V. (Almere, Netherlands).
"Gapfill methods and processing assemblies" was invented by Tommi Tynell (Espoo, Finland) and Viljami Pore (Helsinki).
According to the abstract* released by the U.S. Patent & Trademark Office: "The disclosure relates to methods of filling gaps in semiconductor substrates. A method of filling a gap is disclosed. The method including providing a substrate having a gap in a reaction chamber, providing a first precursor including silicon and carbon into the reaction chamber in a vapor phase, wherein the first precursor includes at least one unsaturated carbon-carbon bond and at least one atom select...