ALEXANDRIA, Va., Feb. 19 -- United States Patent no. 12,230,531, issued on Feb. 18, was assigned to ASM IP Holding B.V. (Almere, Netherlands).
"Substrate supporting apparatus, substrate processing apparatus including the same, and substrate processing method" was invented by Seung Woo Choi (Cheonan-si, South Korea), Seung Hwan Lee (Anseong-si, South Korea) and Ju Hyuk Park (Asan-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing method capable of stably loading a substrate regardless of a variation in pressure of a reaction space includes supplying an inert gas; and forming a thin film by sequentially and repeatedly supplying a source gas, supplying a reaction gas, and acti...