ALEXANDRIA, Va., Aug. 6 -- United States Patent no. 12,381,077, issued on Aug. 5, was assigned to ASM IP Holding B.V. (Almere, Netherlands).
"Methods of filling recesses on substrate surfaces and forming voids therein" was invented by Jungtak Seo (Seongdong-Gu, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method of filling a recess on a surface of a substrate may comprise performing a deposition cycle on the substrate; allowing the deposited material to flow into the recess; and creating a void within the recess in response to the allowing the deposited material to flow. A void size of the void can be based on a ratio of a deposition repeat number of times that the deposition step is repeated...