US Patent Issued to ASM IP Holding on Aug. 19 for "Thin-film deposition method and system" (South Korean, Japanese Inventors)

ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,392,038, issued on Aug. 19, was assigned to ASM IP Holding B.V. (Almere, Netherlands).

"Thin-film deposition method and system" was invented by Shinya Ueda (Kai, Japan), SeokJae Oh (Suwon-si, South Korea), HyunGyu Jang (Osan-si, South Korea), HeeSung Kang (Anyang-si, South Korea), WanGyu Lim (Hwaseong-si, South Korea), HyounMo Choi (Hwaseong-si, South Korea) and YoungJae Kim (Cheonan-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method and system for forming a film on a substrate are disclosed. Exemplary methods include using a first plasma condition to form a layer of deposited material having a good film thickness uniformity, using ...