ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,394,634, issued on Aug. 19, was assigned to ASM IP Holding B.V. (Almere, Netherlands).
"Etch process and a processing assembly" was invented by Charles Dezelah (Helsinki), Viljami Pore (Helsinki) and Varun Sharma (Helsinki).
According to the abstract* released by the U.S. Patent & Trademark Office: "The current disclosure relates to a method of etching etchable material from a semiconductor substrate. The method comprises providing a substrate comprising the etchable material into a reaction chamber and providing a haloalkylamine into the reaction chamber in vapor phase for etching the etchable material. The disclosure further relates to a semiconductor processing assembly, and to a ...