ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,387,930, issued on Aug. 12, was assigned to ASM IP Holding B.V. (Almere, Netherlands).

"Method and wafer processing furnace for forming an epitaxial stack of semiconductor epitaxial layers on a plurality of substrates" was invented by Dieter Pierreux (Pepingen, Belgium), Kelly Houben (Lubbeek, Belgium), Steven Van Aerde (Tielt-Winge, Belgium), Wilco Verweij (Nijkerk, Belgium), Bert Jongbloed (Oud-Heverlee, Belgium) and Charles Dezelah (Helsinki).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method and a wafer processing furnace for forming an epitaxial stack on a plurality of substrates is provided. In a preferred embodiment, the method comprises prov...