ALEXANDRIA, Va., June 6 -- United States Patent no. 12,283,479, issued on April 22, was assigned to ASM IP Holding B.V. (Almere, Netherlands).
"Substrate processing method" was invented by JaeOk Ko (Seoul, South Korea), HeeSung Kang (Anyang-si, South Korea), JaeBin Ahn (Suwon-si, South Korea), SeokJae Oh (Suwon-si, South Korea), WanGyu Lim (Hwaseong-si, South Korea), HyounMo Choi (Hwaseong-si, South Korea), YoungJae Kim (Cheonan-si, South Korea) and Shinya Ueda (Hwaseong-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a substrate processing method capable of filling a film in a gap structure without forming voids or seams in a gap, the substrate processing method including: a first...