ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,442,600, issued on Oct. 14, was assigned to ASIA VITAL COMPONENTS Co. LTD. (New Taipei, Taiwan).
"Thermal module assembling structure" was invented by Sheng-Huang Lin (New Taipei, Taiwan) and Yuan-Yi Lin (New Taipel, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A thermal module assembling structure includes an aluminum base seat which has a heat absorption side, a heat conduction side and a connection section. The connection section is selectively disposed on the heat absorption side, the heat conduction side or embedded in the aluminum base seat (between the heat absorption side and the heat conduction side). The connection section is correspo...