ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,446,192, issued on Oct. 14, was assigned to ASIA VITAL COMPONENTS Co. LTD. (New Taipei, Taiwan).
"Thermal module" was invented by Yuan-Yi Lin (New Taipei, Taiwan) and Fu-Kuei Chang (New Taipei, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A thermal module includes a base seat, at least two heat pipes and multiple heat dissipation units. Each heat pipe has a heat absorption end and a heat dissipation end outward extending from the heat absorption end. The heat absorption ends are disposed on the base seat. The heat dissipation ends of the at least two heat pipes are positioned above the base seat at different heights and misaligned from each oth...