ALEXANDRIA, Va., June 19 -- United States Patent no. 12,331,999, issued on June 17, was assigned to Asia Vital Components Co. Ltd. (New Taipei, Taiwan).
"Thermal module" was invented by Sheng-Huang Lin (New Taipei, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A thermal module includes a radiating fin unit having a plurality of superposed radiating fin assemblies, and a plurality of groups of heat pipes. The heat pipes respectively have a heat absorbing section and a heat dissipating section formed at two opposite ends thereof. The heat absorbing sections in each heat pipe group is in contact with a heat source, and the heat dissipating sections in the same heat pipe group is sandwiched between two a...