ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,510,304, issued on Dec. 30, was assigned to ASIA VITAL COMPONENTS Co. LTD. (New Taipei, Taiwan).
"Heat dissipation device" was invented by Sheng-Huang Lin (New Taipei, Taiwan) and Yuan-Yi Lin (New Taipel, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A heat dissipation device includes an aluminum base seat and any or both of at least one copper two-phase fluid component and a copper heat conduction component. The aluminum base seat has an upper face and a lower face. A connection section is formed on the lower face and a copper embedding layer is disposed on the connection section. Any or both of the copper two-phase fluid component and the copp...