ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,449,209, issued on Oct. 21, was assigned to ASIA VITAL COMPONENTS (SHEN ZHEN) Co. LTD. (Shenzhen, China).
"Heat dissipation structure" was invented by Dan-Jun Chen (Shenzhen, China), Guo-Hui Li (Shenzhen, China) and Jun Wang (Shenzhen, China).
According to the abstract* released by the U.S. Patent & Trademark Office: "A heat dissipation structure includes a base provided on top and bottom surfaces with a solder dispensing opening and a plurality of receiving grooves, respectively; and a plurality of heat pipes. The solder dispensing opening is transversely extended across and communicable with a top of the receiving grooves. The heat pipes are fitted in the receiving grooves and subj...