US Patent Issued to ASIA VITAL COMPONENTS (CHINA) on June 10 for "Structure for evenly applying forces on a heat dissipation fixing base" (Chinese Inventors)

ALEXANDRIA, Va., June 18 -- United States Patent no. 12,328,844, issued on June 10, was assigned to ASIA VITAL COMPONENTS (CHINA) Co. LTD. (Shenzhen, China).

"Structure for evenly applying forces on a heat dissipation fixing base" was invented by Xue-Hui Liu (Shenzhen, China) and Lei Li (Shenzhen, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A structure includes a heat dissipation fixing base having through bores formed at four corners thereof, screw fastening elements extended through the through bores for the heat dissipation fixing base to be fixed on and in contact with a heat source, and two spaced upward extended extension arms; a hold-down member disposed on the heat dissipation fixing base an...