ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,402,243, issued on Aug. 26, was assigned to ASIA PACIFIC MICROSYSTEMS INC. (Hsinchu, Taiwan).
"Circuit carrier board" was invented by Jer-Wei Hsieh (Hsinchu, Taiwan) and Hung-Lin Yin (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A carrier board includes a substrate having a first substrate surface, a second substrate surface, and a substrate hole that penetrates the first substrate surface and the second substrate surface; a magnet sheath disposed in the substrate hole to cover a hole boundary of the substrate hole, and including a first magnetic surface, a second magnetic surface, and an inner periphery that interconnects the first ma...