ALEXANDRIA, Va., June 10 -- United States Patent no. 12,295,187, issued on May 6, was assigned to Ashai Kasei Microdevices Corp. (Tokyo).
"Semiconductor wafer, semiconductor device, and gas concentration measuring device" was invented by Kengo Sasayama (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "Provided are a semiconductor wafer, a semiconductor device, and a gas concentration measuring device having a size reduced by reducing warpage to be even smaller than the sizes that can be achieved by conventional techniques. The semiconductor wafer includes: a wafer substrate, a semiconductor stacked portion formed on a first surface of the wafer substrate, the semiconductor stacked portion being capable o...