ALEXANDRIA, Va., July 30 -- United States Patent no. 12,376,230, issued on July 29, was assigned to Asahi Kasei K.K. (Tokyo).
"Structure with conductive pattern and method for manufacturing same" was invented by Tomoko Kozono (Tokyo) and Toru Yumoto (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "Provided are: a structure with a conductive pattern that can be obtained in a simple manufacturing process and that exhibits favorable interlayer adhesion; and a method for manufacturing same. An embodiment of the present invention provides a structure with a conductive pattern, the structure comprising a base material, and a copper-containing conductive layer arranged on the surface of the base material, wher...