US Patent Issued to ASAHI KASEI on Aug. 12 for "Negative-type photosensitive resin composition and method for producing polyimide and cured relief pattern using same" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,386,259, issued on Aug. 12, was assigned to ASAHI KASEI K.K. (Tokyo).

"Negative-type photosensitive resin composition and method for producing polyimide and cured relief pattern using same" was invented by Tatsuya Hirata (Tokyo), Kohei Murakami (Tokyo) and Takanobu Fujioka (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided are a negative photosensitive resin composition and a method for forming a cured relief pattern using the same with which a high chemical resistance and resolution can be obtained and in which the occurrence of voids in the interface of a Cu layer contacting a resin layer after high-temperature storage evaluation can be su...