US Patent Issued to Asahi Kasei Microdevices on Feb. 3 for "Semiconductor package and drive apparatus" (Japanese Inventors)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,543,510, issued on Feb. 3, was assigned to Asahi Kasei Microdevices Corp. (Tokyo).

"Semiconductor package and drive apparatus" was invented by Keita Okada (Tokyo) and Ryota Sakamoto (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a semiconductor chip having Hall elements built therein, and external terminals arranged on one surface side of the semiconductor chip. A first Hall element and a second Hall element are arranged to be point-symmetrical with respect to a center point of the semiconductor package in a plan view. The first Hall element is at least partially covered by a first external terminal among first ext...