US Patent Issued to Asahi Kasei Construction Materials on April 8 for "Phenolic resin foam laminate board and composite board" (Japanese Inventors)

ALEXANDRIA, Va., April 9 -- United States Patent no. 12,269,249, issued on April 8, was assigned to Asahi Kasei Construction Materials Corp. (Tokyo).

"Phenolic resin foam laminate board and composite board" was invented by Nobuki Hiramatsu (Tokyo), Hisashi Mihori (Tokyo) and Takayuki Kuroda (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "In the phenolic resin foam laminate board (10), a surface material (2) is arranged on at least one of one side of a phenolic resin foam (1) and the back side of the one side. The phenolic resin foam (1) has a density of not less than 22 kg/m3 and not more than 50 kg/m3, a cell diameter of not less than 50 micro metre and not more than 170 micro metre, and a closed cell...