US Patent Issued to ASAHI KASEI, SHINKO-SEIKI on Jan. 27 for "Plasma generating device, plasma processing device, and plasma etching device for seamless roller mold" (Japanese Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,409, issued on Jan. 27, was assigned to ASAHI KASEI K.K. (Tokyo) and SHINKO-SEIKI Co. LTD. (Kobe, Japan).

"Plasma generating device, plasma processing device, and plasma etching device for seamless roller mold" was invented by Tsuneharu Tanaka (Tokyo), Kohei Murakami (Kobe, Japan) and Akira Nagayasu (Kobe, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "In order to enable generation of plasma with higher density in a container with larger capacity, a plasma generating device according to this disclosure is includes a high-frequency circuit (20) having an inductive load and a high-frequency power supply (22) which supplies high-frequency power t...