ALEXANDRIA, Va., July 30 -- United States Patent no. 12,374,601, issued on July 29, was assigned to Arm Ltd. (Cambridge, Great Britain).
"Three-dimensional device cooling" was invented by Paul Harry Gleichauf (Los Altos, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Subject matter disclosed herein may relate to devices and techniques for cooling three-dimensional integrated circuit (IC) devices. In particular embodiments, an IC device may comprise a three-dimensional structure having a first surface adapted to face a mounting surface and a second surface opposite the first surface, and having one or more cavities to extend at least below the second surface."
The patent was filed on June 23, 2023, un...