US Patent Issued to Arisawa on July 8 for "Polyimide resin precursor, polyimide resin, metal-clad laminated board, laminate, and flexible printed wiring board" (Japanese Inventors)

ALEXANDRIA, Va., July 9 -- United States Patent no. 12,351,684, issued on July 8, was assigned to Arisawa MFG. Co. Ltd. (Japan).

"Polyimide resin precursor, polyimide resin, metal-clad laminated board, laminate, and flexible printed wiring board" was invented by Yoshinori Sato (Niigata, Japan), Hiroyuki Matsuyama (Niigata, Japan) and Yoshihiko Konno (Niigata, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A polyimide resin precursor is obtained by allowing a diamine and an acid anhydride to react with each other. The diamine includes p-phenylenediamine, a bis(aminophenoxy)benzene, and 2-(4-aminophenyl)benzoxazol-5-amine. The acid anhydride includes a biphenyl tetracarboxylic dianhydride. The content of...