US Patent Issued to Araca on Oct. 21 for "Silicon carbide (SIC) wafer polishing with slurry formulation and process" (Arizona, Illinois, Minnesota Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,448,545, issued on Oct. 21, was assigned to Araca Inc. (Tucson, Ariz.).

"Silicon carbide (SIC) wafer polishing with slurry formulation and process" was invented by Ara Philipossian (Tucson, Ariz.), Yasa Sampurno (Tucson, Ariz.), Jason A. Keleher (Naperville, Ill.), Katherine Wortman-Otto (Minneapolis), Abigail Linhart (Harvard, Ill.) and Kiana A. Cahue (Joliet, Ill.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for polishing a silicon carbide surface. The silicon carbide surface is polished with a particulate abrasive while exposed to a composition of water, an oxidizing agent and an electrophile."

The patent was filed on May 10, 2022, under ...