US Patent Issued to APTIV TECHNOLOGIES on Sept. 16 for "Integral features providing improved flexible printed circuit folding and connection capability" (Ohio Inventors)

ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,418,979, issued on Sept. 16, was assigned to APTIV TECHNOLOGIES AG (Schaffhausen, Switzerland).

"Integral features providing improved flexible printed circuit folding and connection capability" was invented by David R. Peterson (Aurora, Ohio), Joseph Sudik Jr. (Niles, Ohio), David G. Siegfried (Warren, Ohio) and Jared Bilas (North Bloomfield, Ohio).

According to the abstract* released by the U.S. Patent & Trademark Office: "A flexible circuit (FC) and a method of forming the FC each include providing a first dielectric layer, applying a plurality of conductive circuit traces that are substantially parallel to each other to the first dielectric layer, providing a second dielectric la...