US Patent Issued to Aptiv Technologies on June 24 for "Integrated flexible circuit attachment features with sound dampening and method of forming said features" (Ohio Inventors)

ALEXANDRIA, Va., June 25 -- United States Patent no. 12,340,924, issued on June 24, was assigned to Aptiv Technologies AG (Schaffhausen, Switzerland).

"Integrated flexible circuit attachment features with sound dampening and method of forming said features" was invented by David R. Peterson (Aurora, Ohio), Joseph Sudik Jr. (Niles, Ohio), Jesse Braun (Bentleyville, Ohio) and David Siegfried (Warren, Ohio).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring assembly including a flex circuit including a plastic laminate layer and a mount location configured to receive a fastener secured to a substrate. The wiring assembly further includes a flex circuit attachment feature, the flex circuit attachment feature...