US Patent Issued to Aptiv Technologies on July 8 for "Sheet metal enclosure with an array of extruded heat transfer holes" (Indian Inventors)

ALEXANDRIA, Va., July 9 -- United States Patent no. 12,353,258, issued on July 8, was assigned to Aptiv Technologies AG (Schaffhausen, Switzerland).

"Sheet metal enclosure with an array of extruded heat transfer holes" was invented by Shrikant Bhadri (Bengaluru, India), Ravindra Kulkarni (Bengaluru, India) and Kesav Kumar Sridharan (Bengaluru, India).

According to the abstract* released by the U.S. Patent & Trademark Office: "Described herein is an enclosure comprising at least one planar portion with an array of extruded holes disposed thereon. The holes are extruded along an axis normal to a plane of the planar portion and configured as apertures for heat transfer through the enclosure. The holes have an inner diameter and have a height...